The Electronics Design and Manufacture Conference delivers the latest information on a host of topics critical to design & assembly for future electronics driving manufactured products, devices or systems. The programme will include 2 day workshop sessions and a series of free shorter overview sessions.

International and local speakers will address the latest issues and challenges facing designers, engineers and integrators of production electronics for industrial & commercial systems and product manufacturing across all industry sectors.  

To download the conference workshop program please CLICK HERE. 

To download the free short session program please CLICK HERE

2015 Speaker Highlights:

Control of Noise, Signal Integrity & EMI in High Speed Circuits & Printed Circuit Boards - Rick Hartley – RHartley Enterprises

When time-varying (AC) currents flow in a PC board, an electric and a magnetic field are present.  These fields, when not controlled, are the source of noise, electromagnetic interference (“EMI”) and signal integrity (“SI”) issues.

What we classically call ‘Noise’ is ‘Intentional Energy’ which we fail to control and contain.  Unharnessed energy can and will generate many forms of interference.  What this statement fails to say is ‘Why’ this happens… why are some circuits noisy, while others are not?

Compounding the problem are today’s extremely fast integrated circuits.  Output edge rate (rise/fall time) of devices, more than the rate at which they are clocked, is a leading factor with regard to SI, EMI and Noise issues in PC Boards.  A circuit with 200 ps rise time devices can generate serious problems whether clocked at 2 MHz, 200 MHz or 2 GHz.

Knowing how to design circuit boards to contain and control energy fields and knowing how to mitigate and control the effects of high speed devices is the key to successful design of low noise circuits. 

Rick Hartley was the Senior Principal Engineer at L-3 Communication, Avionics Systems.  He is the principal of RHartley Enterprises, through which he consults and teaches internationally.  Rick’s focus is on correct design of PC boards to prevent & solve problems.  He has consulted with major corporations in the US, Australia, Canada, Mexico, Brazil, China, Japan, England, France, Spain and Germany.  His design career has focused on circuits and PC boards for computers, aircraft avionics and telecommunications.  Rick has a degree in engineering and 49 years of experience in electronics and has written numerous technical papers on methods to control EMI and signal integrity.  He is currently on the IPC Designers Council Executive Board and is a past international chairman of the IPC Designers Council.

Enabling Implementation of Advanced Technologies - Dr Denis Barbini -Universal Instruments’ Advanced Process Laboratory

Universal Instruments Corp’s Advanced Process Laboratory has developed a data based focus for providing tools and case studies to implement advanced packaging designs into your assemblies.  An in depth look at identifying the impact of novel technologies in electronics manufacturing from fine pitch printing, to PoP, 01005, LGA/BGA and novel laminate materials.  Incorporating these enabling technologies present challenges – process change requirements, yield and reliability impacts.  These technologies demand intense research and provide a unique perspective for design for manufacturability (DfM) and reliability (DfR). 

This session is aimed at Quality Engineers, Failure Analysis Engineers, Reliability Engineers, Design Engineers, Process Engineers and Project Managers and will highlight:-

• Trends in component evolution & how to overcome the associated implementation challenges;
• Best practices in assembly – printing, inspection, placement, & soldering;
• Understanding challenges in materials – alloys, pastes, PCB finishes, etc;
• Analytical testing techniques & how to identify root causes for production failures;
• Lead-free laminate selection & testing procedures: Can your board withstand 9x reflow?
• Learned lessons from actual failure analysis case studies.

Denis C. Barbini, Ph.D. is the Associate Director of the Universal Instruments’ Advanced Process Laboratory.  He started his career in the electronics manufacturing world after earning his Doctorate in Chemistry from Binghamton University.  Denis has travelled the world visiting over 30 countries providing solutions to people and companies designing and manufacturing devices such as cell phones and computers to pacemakers and aerospace devices.  These companies look to implement cost effective, reliable and robust processes that deliver specified functionality and reliability.  His current focus is identifying the critical needs in emerging technologies and electronics assembly processes in order to develop specific research and development projects.  Denis has authored hundreds of peer reviewed articles, contributed to several books and presented to thousands of his peers on the results of his research over the past 17 years. 

MELBOURNE PARK FUNCTION CENTRE

9 - 10 SEPTEMBER 2015

Wednesday 9 September

Thursday 10 September

Further information email: This email address is being protected from spambots. You need JavaScript enabled to view it.

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