Doug Brooks has advanced degrees in Electronics (Stanford University) and Business Administration (University of Washington). He started his career as an electronics design engineer on the Surveyor Spacecraft Program  at Hughes Aircraft Co. His career then led to positions of Vice President, General Manager and President of such companies as LODEC Inc, Kristler-Morse, ELDEC, and Bourns Inc. He is active in numerous trade associations and has a regular monthly column, 'Brookspeak' in Printed Circuit Design Magazine.

Doug is a regular speaker at PCB Design Conferences worldwide and has spoken in such diverse cities as Moscow, Beijing, Taipei and Tokyo. His seminars are aimed at PCB designers and people with basic engineering skills. He places a large emphasis on understanding technical concepts without a lot of math, and on explaining why there might be differing views about an issue among different engineers. Doug's courses are acclaimed worldwide by the PCB design community and we are pleased to have him present them in Australia for the first time. 

Abstract:

When we talk about signal integrity issues, we talk about things like rise times, bypass capacitors, inductance, and impedence - concepts many designers either never learned or have forgotten. This is a course in basic electrical engineering principles for those who are "rusty" in the basics. We start with a discussion on what, exactly, is current and voltage (and why we care)? We will discuss the concept of "return current" and how it is that it causes 80% of signal integrity problems on circuit boards. Included in this section are the " Five Basic Laws of Electronics" and discussion about frequencies, wavelengths, harmonics, and propogation speeds. Next we look at impedence (and it's components, resistance and reactance, including capacitance and inductance) and learn about phase shifts. Closing off the first section with electrical and magnetic coupling (e.g. EMI).

The course also covers basic circuit concepts, including Time Constants and the Skin Effect plus a full discussion on Trace current/ Temperature effects on boards and fusing currents. The final section of the course covers how currents flow through various types of semiconductors. The purpose of the course is to give the attendee everything he/she needs to fully understand signal integrity issues and to effectively communicate with engineers back in the office.

Topics covered will include:

Basic Concepts

• Current
• Voltage
• The Five basic laws of Electronics
• Frequencies, wavelengths, and harmonics
• Propagation Speeds

Impedence to Current Flow

• Resistance - Capacitive/ Inductive/ Nature/ Frequency & Phase Shift
• Impedence - Nature/ Frequencies & Phase Shift/ Resonance

Fields

• Electric/ Electric Charge Coupling
• Magnetic/ Magnetic (Inductive) Coupling
• Motors, Generators & Transformers

Measuring Current & Voltage - Some Circuit Concepts

• Voltage Dividers
• Time Constants
• Power Dissipation/ Trace/ Current/ Temperature/ Effects

Semiconductor

Board Design & Layout for SI and EMI    (Code: SW1)

- One day workshop presented by Susy Webb - Fairfield Nodal USA 

(Register NOW for this session)       (Download PDF Session Doc)

Susy Webb is a senior PCB designer with 32 years experience. Her career includes experience in a variety of fields, including point-to-point microwave network systems, oceanographic oil exploration equipment, and CPCI and ATX computer motherboards. She has set up company standards, documentation, procedures and library conventions for several companies. Susy is a regular speaker at the PCB and IPC conferences and has made presentations internationally as well, discussing practical implementation of engineering concepts into board layout and methods to improve and advance the overall design and flow of printed circuit boards. She is CID certified and has been a writer/ columnist for Printed Circuit Design & Fab magazines. Susy is currently Senior PCB Designer with the Systems Division, Fairfield Nodal USA. She is an active member of the IPC Designer's Council Executive Board at the international level and a member of it's education committee. She is also a past president of the Houston (Tx) Chapter of the Designer's Council.

Abstract:                                    

When beginning a complex board design, we are faced with a unique set of needs and questions. Where do we start the process? How do we organise the information on all those schematic pages? What is the best way for these parts and sections to fit together electronically and yet still fit into the board outline? What are the plane and stackup issues? How do we place everything and still have routing room with good signal integrity? This presentation will address these questions and more with some laws of physics, some ideas for making complex placement and routing issues more manageable, and lots of examples.

Topics:

• Some Electronic Basics and Why Each is Important to Layout
• Working with Rise Time
• Containing Return and Loops
• Controlling Impedence and Reflections
• Control Decoupling and Power Distribution
• V=L*di/dt Effects
• Finding and Minimizing Antennas
• Filtering Signals
• Parts Placement
• Setting Up a Good Board Structure Fanout and Routing

Thursday 15 September 2011

Counterfeit Component Detection and Prevention   (Code: CCW)

- One day workshop with Rick Stanton, Supplier Qlty Engineer USA 

(Register NOW )    (Download PDF Session Doc)

Rick Stanton has worked in the electronic manufacturing service industry for more than 30 years. He has extensive experience  in Quality Engineering and Training in both suface-mount and through-hole assembly. He has worked with some of the top contract manufacturing companies including AT&T Network Systems, Raytheon, General Electric, Solectron, Jabil Circuits, Harris Corporation and Symetrics Industries. In his role as Supplier Quality Engineer one of his primary tasks is the monitoring of newly delivered material/ product to ensure that only the highest level of electronic components are allowed to enter their manufacturing system. Rick has developed several Suspect Counterfeit Component Prevention and Detection Inspection procedures and associated internal training/ certification courses specifically designed for the recognition and prevention of counterfeit components. He is a certified IDEA-ICE-3000 Counterfeit Component Auditor/ Inspector (IDEA is the Independent Distributors of Electronics Association). Rick is also an IPC-J-STD-001 and IPC-A-610 Certified IPC Trainer. He has taught EMS techniques including CCA Hand Soldering, Compliant Rework, Point to Point wiring, Circuit Pad and Track Repair and entry level solder training to thousands of engineers, test technicians, production assemblers and quality personnel.

Abstract:

Counterfeit electronic components have become a global concern and today no one is immune to receiving counterfeit product. The infastructure of our commercial and defense supply chains have been seriously compromised on a daily basis. This 12 billion dollar a year fraudulent business needs to be addressed before we experience a disaster of catastrophic proportions. This workshop will detail the detection of counterfeit components and prevention of them entering your supply chain. A plan to help screen out suspect components will be presented as well as other useful information and suggestions for implementing your own detection, inspection and prevention program. Rick will also have samples of some of the "best" counterfeit components that are infiltrating the industry.

Who Should Attend:

Component and design engineers, inward goods inspection for both EMS and OEM companies, process and quality control engineers and technicians, outwards goods inspectors, test engineers, supply chain managers, manufacturing and production managers, engineers and technicians, purchasing managers and officers, component suppliers - basically anyone who has an interest in ensuring that counterfeit electronic components do not impact on their end product or the products and services they supply.

Workshop Agenda:

1.   The definition of a counterfeit electronic component as per the SAE AS5553 standard.

2.   Documented examples of systems that have been compromised by the installation of counterfeit electronic parts

3.   The various types of counterfeit parts and visual representations of suspect and counterfeit parts that have been intercepted using a basic counterfeit check point list and procedures. This will include presentation of images of component internal dies with wire bond deformities provided by a US based X-Ray Equipment Manufacturer who travelled to China to procure parts directly  from Shenzhen's Component Mall.

4.   The importance of developing and implementing a robust internal counterfeit component detection procedure

5.   How to develop a screening process for parts including inspection, testing and other detection means

6.   The various types of testing, how to use them to detect counterfeit parts and their effectiveness

7.   Supplier audit qualification requirements

8.   Implementing your own detection, inspection and prevention program

The Four Categories of Signal Integrity Issues and Their Solutions:

Where are You Positioned?    (Code: DB2)

- one day workshop presented by Doug Brooks, Ultracad USA

(Register NOW for this session)            (Download PDF Session Doc) 

Abstract:

I see signal integrity issues on printed circuit boards as falling into one of four categories. All board designers are operating in at least one of these categories. The driving force that moves us into a following category is decreasing rise time. The first category is trivial - no signal integrity problems however the other three present some difficult issues for board designers. In this course we discuss the other three categories, the problems presented by them, and the solutions the industry has found for them. These three categories are: (a) problems primarily caused by inductance (EMI, Crosstalk, Ground Bounce [and the role bypass capacitors play], and signal reflections [ and the role transmission lines and controlled impedence plays]; (b) problems resulting from resistance varying with frequency (skin effect and dielectric losses - the problem of lossy transmission lines); and (c) what happens when wavelengths become so small that the solution can no longer be physically implemented?

Emphasis will be placed on an understanding of the fundamental issues as well as understanding  the solutions the industry has come up with and why those solutions actually work? Finally we will discuss why you should believe my (or anyone else's) design guidelines?

Overview:

Signal Integrity Issues & Solutions

      Basic Concepts

• Current
• Voltage
• Frequencies, rise times and harmonics

The Four Stages of Signal Integrity Issues

1.   None

2.   Inductance - the nature of the problems and solutions

• EMI
• Power Distribution (Ground Bounce, Bypass Capacitors)
• Crosstalk
• Signal Reflections (transmission Lines)

3.   Resistance No Longer Independent of Frequency (Lossy Transmission Lines)

• Nature of the problems (Skin Effect, Dielectric Loss)
• Solutions

4.   Wavelengths so small solutions cannot be implemented

Design Guidelines - What to Believe?

Designing Complex Boards     (Code: SW2)

- Half day workshop presented by Susy Webb - Fairfield Nodal USA (Thurs 15 Sept/ 9.00am - 12noon)

(Register NOW for this session)         (Download PDF Session Doc)

When beginning a complex board design, we are faced with a unique set of needs and questions. Where do we start the process? how do we organise the information on all those schematic pages? What is the best way for these parts and sections to fit together electronically and yet still fit into the board outline? What is a good stackup for this particular board? How do we place everything and still have routing room with good signal integrity and EMI qualities? This presentation will address these kinds of questions and more with some laws of physics, information about why some practices might work better than others, and lots of examples.

      Topics Covered:

• Schematic Placement
• Part Issues
• Examples of Placement Practices of Different Designs
• Some Physics that Must be Considered
• Placement Concepts
• Working out the Planes, Stack and Routing Issues

The Science of PCB Stackups         (Code: SW3)

- Half day workshop presented by Susy Webb - Fairfield Nodal USA (Thurs 15 Sept/ 1.00 pm - 5.00 pm)

(Register NOW for this session)       (Download PDF Session Doc)

The stackup of a printed circuit board is one of the most important parts of the design layout. It affects the way the signals flow on the board, and so can affect many other aspects of the functioning board like impedence control, return current, and the amount of crosstalk, common mode currents and displacement currents. In today's higher speed designs it is critical to manage this step well. We will discuss how the currents actually flow through the stackup layers in order to show how to build a stackup that leads to good signal integrity.

      Topics Covered:

• Determining Layer Count
• Choosing Routing Layers
• Layer Paired Routing
• Current Flow from Layer to Layer
• Stackup examples - What's Good and Not So Good?
• Building a board stack 

High Reliability Hand Soldering, Rework & Repair  (Code: HRS)

- one day workshop lead by Master IPC Trainer - Terry Clitheroe -IPC Master Trainer 

(Register NOW for this session)          (Download PDF Session Doc)

Terry Clitheroe is a Master IPC Trainer for IPC-A-600, IPC-J-STD-001, IPC-A-610, IPC/WHMA-A-620 and IPC-7711/7721 for the SMCBA IPC Training Centre. Terry has a wide background in electronics assembly, soldering training, repair and research. He was an instructor with the Royal Australian Air Force and has conducted high reliability soldering and IPC training and cerification for countless companies and conducted courses in Australia, NZ, Malaysia and the Philippines. Terry is on the IPC Standards Committees for the A-610, J-STD-001 and 7711/21 standards.

He has been the recipient of several IPC recognition awards and in addition to his Master IPC Trainer status he has a Masters of Education Degree.

Abstract:

This is our most popular intensive practical workshop and is ideal for all levels of experience for those wanting to ensure their skills produce high reliability results meeting IPC Class 3 requirements.Terry will demonstrate that conventional hand soldering tools already operating in most workshops can be used to produce quality hand soldered products that comply with Class 3 requirements of the IPC-J-STD-001 Revision E and IPC-A-610 Revision E. Techniques taught will be in accordance with the IPC-7711/21B Rework  and Repair standard.

This workshop presents the opportunity for manufacturers  and repair organisations  to upgrade their workers skills in soldering, rework and repair. It will assist them to implement work skills and inspection habits to carry them through the next generation of manufacturing requirements. A variety of equipment will be available for participants to trial and practise the skills demonstrated.

      Topics Covered:

• Soldering, Rework & Repair Requirements and Standards
• Soldering Tools and Materials
• Soldering Procedures
• OHS and ESD considerations
• Best Practice Soldering Techniques
• Inspection and Conformance to Standards